CVE-2023-28561

CVSS v3 9.8 CRITICAL

9.8^/10

CVSS v3 : CRITICAL

Vector :

Exploitability : 3.9 / Impact : 5.9

Attack Vector NETWORK

Attack Complexity LOW

Privileges Required NONE

User Interaction NONE

Confidentiality Impact HIGH

Integrity Impact HIGH

Availability Impact HIGH

Scope UNCHANGED

M

emory corruption in QESL while processing payload from external ESL device to firmware.

References

Link	Resource
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin	Vendor Advisory
https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin	Vendor Advisory

Configurations

Configuration 1 (hide)

AND

cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*

History

21 Nov 2024, 07:55

Type	Values Removed	Values Added
References	~~() https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin - Vendor Advisory~~	() https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin - Vendor Advisory

Information

Published : 2023-08-08 10:15

Updated : 2024-11-21 07:55

NVD link : CVE-2023-28561

Mitre link : CVE-2023-28561

CVE.ORG link : CVE-2023-28561

JSON object : View

Products Affected

CWE

CWE-120

Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')

CWE-787

Out-of-bounds Write

{"id": "CVE-2023-28561", "metrics": {"cvssMetricV31": [{"type": "Secondary", "source": "[email protected]", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 9.8, "attackVector": "NETWORK", "baseSeverity": "CRITICAL", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}, {"type": "Primary", "source": "[email protected]", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 9.8, "attackVector": "NETWORK", "baseSeverity": "CRITICAL", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}]}, "published": "2023-08-08T10:15:14.447", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin", "tags": ["Vendor Advisory"], "source": "[email protected]"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin", "tags": ["Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Secondary", "source": "[email protected]", "description": [{"lang": "en", "value": "CWE-120"}]}, {"type": "Primary", "source": "[email protected]", "description": [{"lang": "en", "value": "CWE-787"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in QESL while processing payload from external ESL device to firmware."}, {"lang": "es", "value": "Corrupci\u00f3n de memoria en QESL al procesar la carga \u00fatil del dispositivo ESL externo al firmware."}], "lastModified": "2024-11-21T07:55:29.340", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "F466A5BD-1912-4811-9A93-81555F101D46"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "0F92914E-16F6-4A25-9FEF-FB7CB3377132"}], "operator": "OR"}], "operator": "AND"}], "sourceIdentifier": "[email protected]"}